主页 > 环亚观天下 >
资讯中心

联系我们

SPIL FOW Assembly Patent Breaks Die-Stacked Limitation

来源:K8 发布日期2018-10-02


Leading in High Volume Production When Currently ApplieAAAAAAAA>on 3-chip NAND Flash CarAAAAAAA> TAICHUNG, Taiwan, Feb. 5 /Xinhua-PRNewswire-FirstCall/ -- Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company")(TAIEX: 2325; Nasdaq: SPIL), a leading semiconductor assembly and test services provider, today announced that it has achieved high volume production of Flash Card with its Film Over Wire (FOW) technology. FOW technology together with wafer thinning technology and low loop wire bonding technology, solves dimension problems in multi-chip packages (MCP), and successively saves around 14% space by reducing both package height and width. The FOW technology allows the stacked chips to be variably-sized according to actual needs without the problem of bonding wires being damaged during the mounting of the overlaid chip.

Modern electronics have been continuously facing the trends of getting lighter, thinner, shorter, and smaller yet with multi-functions. This results in each component of a product shrinking in size, to save the overall package space and reduce its weight. Challenges arise to the manufacturers in many aspects. Stacked Die Package has become a solution to space saving. One of its characteristics is that many dies were stacked and packaged under a restricted space. However, Stacked Die Package is encountering a technological bottleneck recently. As the number of chips stacked increased, the final height and width may go beyond the package body.

SPIL introduced FOW packaging technology (Taiwan Patent No. 142,309; US Patent No. US 6,388,313) that successively overcomes that space restriction bottleneck. Unlike the conventional method of die-stacking, it saves 14% more on both package height and width, thus saves more space to accommodate more chips. When applied to products of higher layers, and vertical stacking of similar-sized chips, it can still meet the requirement of Chip Scale Package. Therefore, SPIL's FOW technology supports chip makers' design flexibility, and helps customers to enhance their product competitiveness by breaking space limitation of the package. At present, it is applied to high density DRAM and Flash.

SPIL has successfully applied the FOW technology on Flash Card, leading the market in 3-chip NAND Flash Card, which is currently in high volume production, and obtains favorable comments from customers because of their increase in market share. In 2007, SPIL is moving further to 9-chip Flash Card, a big step ahead, and broadens the technology gap with its competitors. SPIL is going to assist its customers to gain greater business opportunities with the most advanced FOW technology in the market.

About SPIL

Siliconware Precision Industries Co., Ltd. ("SPIL")(Nasdaq: SPIL; TSE:2325) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that range from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, to drop ship. Products include advanced leadframe and substrate packages, which are widely used in personal computers, communications, internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fables design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL's web site at http://www.spil.com.tw .

SPIL Spokesperson

Ms. Eva Chen, CFO

Tel: +886-4-25341525#1528

Email: evachen@spil.com.tw

For further information, please contact IR dept.

Ms. Janet Chen

Tel: +886-2-27028898#105

Fax: +886-2-27029268

Email: janet@spiltp.com.tw

本文源自: AG环亚游戏_AG环亚娱乐游戏_AG环亚游戏最佳线路_搜狐体育

Copyright © 2005-2016 http://www.qgdamoda.com AG环亚游戏_AG环亚娱乐游戏_AG环亚游戏最佳线路_搜狐体育版权所有 AG环亚游戏_AG环亚娱乐游戏_AG环亚游戏最佳线路_搜狐体育